Part Number Hot Search : 
AWS5523 A2106V IRG4P AWS5523 FR305 248YF 4FST3 N74F32D
Product Description
Full Text Search
 

To Download M2S56D20ATP Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  1 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram preliminary some of contents are subject to change without notice. description m2s56d20akt is a 4 - bank x 16,777,216 - word x 4 - bit, m2s56d30akt is a 4 - bank x 8,388,608 - word x 8 - bit, m2s56d40akt is a 4 - bank x 4,194,304 - word x 16 - bit, double data rate synchronous dram, with sstl_2 interface. all c ontrol and address signals are referenced to the rising edge of clk. input data is registered on both edges of data strobe, and output data and data strobe are referenced on both edges of clk. the m 2s56d20/30/40akt achieves very high speed data rate up to 133mhz, and are suitable for main me mory in computer systems. features - vdd=vddq=2.5v + 0.2v - double data rate architecture; two data transfers per clock cycle - bidirectional, data strobe (dqs) is transmitted/received with d ata - differential clock inputs (clk and /clk) - dll aligns dq and dqs transitions with clk transitions edges of dqs - commands entered on each positive clk edge; - data and data mask referenced to both edges of dqs - 4 bank operation controlled by ba0, ba1 (bank address) - /cas latency - 2.0/2.5 (programmable) - burst length - 2/4/8 (programmable) - burst type - sequential / interleave (programmable) - auto precharge / all bank precharge controlled by a10 - 8192 refresh cycles /64ms (4 banks concurrent refresh) - auto refresh and self refresh - row address a0 - 12 / column address a0 - 9,11(x4)/ a0 - 9(x8)/ a0 - 8(x16) - sstl_2 interface - 400 - mil, 66 - pin thin small outline package (tsop ii) - jedec standard 125 mhz 100 mhz - 10 cl=2.5 * cl=2 * 133 mhz 133 mhz 133 mhz - 75 a 100 mhz - 75 clock rate speed grade operating frequencies * cl = cas(read) latency
2 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram clk,/clk : master clock cke : clock enable / cs : chip select / ras : row address strobe / cas : column address strobe / we : write enable dq0 - 7 : data i/o dqs : data strobe dm : write mask vref : reference voltage a0 - 12 : address input ba0,1 : bank address input vdd : power supply vddq : power supply for output vss : ground vssq : ground for output pin configuration(top view) vdd vdd vdd nc dq0 dq0 vddq vddq vddq nc nc dq1 dq0 dq1 dq2 vssq vssq vssq nc nc dq3 nc dq2 dq4 vddq vddq vddq nc nc dq5 dq1 dq3 dq6 vssq vssq vssq nc nc dq7 nc nc ldqs nc nc nc vdd vdd vdd nc nc nc nc nc ldm / we / we / we / cas / cas / cas / ras / ras / ras / cs / cs / cs nc nc nc ba0 ba0 ba0 ba1 ba1 ba1 a10/ap a10/ap a10/ap a0 a0 a0 a1 a1 a1 a2 a2 a2 a3 a3 a3 vdd vdd vdd vss vss vss dq15 dq7 nc vssq vssq vssq dq14 nc nc dq13 dq6 dq3 vddq vddq vddq dq12 nc nc dq11 dq5 nc vssq vssq vssq dq10 nc nc dq9 dq4 dq2 vddq vddq vddq dq8 nc nc nc nc nc vref vref vref vss vss vss udm dm dm / clk / clk / clk clk clk clk cke cke cke nc nc nc a12 a12 a12 a11 a11 a11 a9 a9 a9 a8 a8 a8 a7 a7 a7 a6 a6 a6 a5 a5 a5 a4 a4 a4 vss vss vss x 8 x 16 x 4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 64 pin stsop pin pitch 0.4 mm vddq vddq vddq udqs dqs dqs vssq vssq vssq
3 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram pin function clk, /clk input clock: clk and /clk are differential clock inputs. all address a nd control input signals are sampled on the crossing of the positive edge o f clk and negative edge of /clk. output (read) data is referenced to the c rossings of clk and /clk (both directions of crossing). cke input clock enable: cke controls internal clock. when cke is low, inte rnal clock for the following cycle is ceased. cke is also used to select a uto / self refresh. after self refresh mode is started, cke becomes asynchronous inp ut. self refresh is maintained as long as cke is low. / cs input chip select: when /cs is high, any command means no operation. / ras, /cas, /we input combination of /ras, /cas, /we defines basic commands. a0 - 12 input a0 - 11 specify the row / column address in conjunction with ba0,1. the row address is specified by a0 - 12. the column address is specified by a0 - 9,11(x4), a0 - 9(x8) and a0 - 8(x16). a10 is also used to indicate precharge option. when a10 is high at a read / write command, an auto prec harge is performed. when a10 is high at a precharge command, all banks ar e precharged. ba0,1 input dq0 - 15(x16), dq0 - 7(x8), dq0 - 3(x4), input / output dqs vdd, vss power supply power supply for the memory array and peripheral circuitry. vddq, vssq power supply vddq and vssq are supplied to the output buffers only. bank address: ba0,1 specifies one of four banks to which a comm and is applied. ba0,1 must be set with act, pre, read, write commands . data input/output: data bus data strobe: output with read data, input with write data. edge - aligned with read data, centered in write data. used to capture write da ta. for the x16, ldqs corresponds to the data on dq0 - dq7; udqs correspond to the data on dq8 - dq15 symbol type description dm input input data mask: dm is an input mask signal for write data. inpu t data is masked when dm is sampled high along with that input data during a write access. dm is sampled on both edges of dqs. although dm pins are input only, the dm loading matches the dq and dqs loading. for the x16, ldm corresponds to the data on dq0 - dq7; udm corresponds to the data on dq8 - dq15. input / output vref input sstl_2 reference voltage.
4 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram type designation code this rule is applied to only synchronous dram family. mitsubishi main designation speed grade 10: 125 mhz@cl=2.5,100mhz@cl=2.0 75: 133 mhz@cl=2.5 ,100mhz@cl=2.0 package type tp: tsop(ii) process generation function reserved for future use organization 2 n 2: x4, 3: x8, 4: x16 d dr synchronous dram density 56: 256m bits interface v:lvttl, s:sstl_3, _2 memory style (dram) m 2 s 56 d 3 0 a tp ? 75a block diagram / cs / ras / cas / we udm, ldm memory array bank #0 dq0 - 15 i/o buffer memory array bank #1 memory array bank #2 memory array bank #3 mode register control circuitry address buffer a0 - 12 ba0,1 clock buffer clk cke control signal buffer qs buffer udqs,ldqs dll 75 a: 133mhz@cl=2.5, 133mhz@cl=2.0 / clk
5 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram basic functions the m2s56d20/30/40akt provides basic functions, bank (row) activ ate, burst read / write, bank (row) precharge, and auto / self refresh. each command is define d by control signals of /ras, /cas and /we at clk rising edge. in addition to 3 signals, /cs , cke and a10 are used as chip select, refresh option, and precharge option, respectively. to k now the detailed definition of commands, please see the command truth table. / cs chip select : l=select, h=deselect / ras command / cas command / we command cke refresh option @refresh command a10 precharge option @precharge or read/write command clk define basic commands / clk activate (act) [/ras =l, /cas =/we =h] act command activates a row in an idle bank indicated by ba. read (read) [/ras =h, /cas =l, /we =h] read command starts burst read from the active bank indicated by ba. first output data appears after /cas latency. when a10 =h at this command, the bank is deactiva ted after the burst read (auto - precharge, reada ) write (write) [/ras =h, /cas =/we =l] write command starts burst write to the active bank indicated by ba. total data length to be written is set by burst length. when a10 =h at this command, the bank i s deactivated after the burst write (auto - precharge, writea ) precharge (pre) [/ras =l, /cas =h, /we =l] pre command deactivates the active bank indicated by ba. this co mmand also terminates burst read /write operation. when a10 =h at this command, all banks are dea ctivated (precharge all, prea ). auto - refresh (refa) [/ras =/cas =l, /we =cke =h] refa command starts auto - refresh cycle. refresh address including bank address are genera ted internally. after this command, the banks are precharged automat ically.
6 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram command truth table h=high level, l=low level, v=valid, x=don't care, n=clk cycle nu mber note: 1. applies only to read bursts with autoprecharge disabled; this co mmand is undefined (and should not be used) for read bursts with autoprecharge enabled, and for write burst s. 2. ba0 - ba1 select either the base or the extended mode register (ba0 = 0, ba1 = 0 selects mode register;ba0=1 , ba1 = 0 selects extended mode register; other combinations of ba0 - ba1 are reserved; a0 - a12 provide the op - code to be written to the selected mode register. command mnemonic cke n - 1 cke n / cs / ras / cas / we ba0,1 a10 / ap a0 - 9, 11 - 12 deselect desel h x h x x x x x x no operation nop h x l h h h x x x row address entry & bank activate act h h l l h h v v v single bank precharge pre h h l l h l v l x precharge all banks prea h h l l h l h x column address entry & write write h h l h l l v l v column address entry & write with auto - precharge writea h h l h l l v h v column address entry & read read h h l h l h v l v column address entry & read with auto - precharge reada h h l h l h v h v auto - refresh refa h h l l l h x x x self - refresh entry refs h l l l l h x x x self - refresh exit refsx l h h x x x x x x l h l h h h x x x burst terminate term h h l h h l x x x mode register set mrs h h l l l l l l v x note 1 2
7 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram function truth table current state /cs /ras /cas /we address command action notes idle h x x x x desel nop l h h h x nop nop l h h l ba term illegal 2 l h l x ba, ca, a10 read / write illegal 2 l l h h ba, ra act bank active, latch ra l l h l ba, a10 pre / prea nop 4 l l l h x refa auto-refresh 5 l l l l op-code, mode- add mrs mode register set 5 row active h x x x x desel nop l h h h x nop nop l h h l ba term nop l h l h ba, ca, a10 read / reada begin read, latch ca, determine auto-precharge l h l l ba, ca, a10 write / writea begin write, latch ca, determine auto-precharge l l h h ba, ra act bank active / illegal 2 l l h l ba, a10 pre / prea precharge / precharge all l l l h x refa illegal l l l l op-code, mode- add mrs illegal h x x x x desel nop (continue burst to end) l h h h x nop nop (continue burst to end) l h h l ba term terminate burst l h l h ba, ca, a10 read / reada terminate burst, latch ca, begin new read, determine auto- precharge 3 l h l l ba, ca, a10 write / writea illegal l l h h ba, ra act bank active / illegal 2 l l h l ba, a10 pre / prea terminate burst, precharge l l l h x refa illegal l l l l op-code, mode- add mrs illegal read(auto- precharge disabled)
8 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram function truth table (continued) current state /cs /ras /cas /we address command action notes h x x x x desel nop (continue burst to end) l h h h x nop nop (continue burst to end) l h h l ba term illegal l h l h ba, ca, a10 read / reada terminate burst, latch ca, begin read, determine auto-precharge 3 l h l l ba, ca, a10 write / writea terminate burst, latch ca, begin write, determine auto-precharge 3 l l h h ba, ra act bank active / illegal 2 l l h l ba, a10 pre / prea terminate burst, precharge l l l h x refa illegal l l l l op-code, mode- add mrs illegal h x x x x desel nop (continue burst to end) l h h h x nop nop (continue burst to end) l h h l ba term illegal l h l h ba, ca, a10 read / reada illegal for same bank 6 l h l l ba, ca, a10 write / writea illegal for same bank 6 l l h h ba, ra act bank active / illegal 2 l l h l ba, a10 pre / prea precharge / illegal 2 l l l h x refa illegal l l l l op-code, mode- add mrs illegal h x x x x desel nop (continue burst to end) l h h h x nop nop (continue burst to end) l h h l ba term illegal l h l h ba, ca, a10 read / reada illegal for same bank 7 l h l l ba, ca, a10 write / writea illegal for same bank 7 l l h h ba, ra act bank active / illegal 2 l l h l ba, a10 pre / prea precharge / illegal 2 l l l h x refa illegal l l l l op-code, mode- add mrs illegal write(auto- precharge disabled) read with auto-precharge write with auto-precharge
9 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram function truth table (continued) current state /cs /ras /cas /we address command action notes h x x x x desel nop (idle after trp) l h h h x nop nop (idle after trp) l h h l ba term illegal 2 l h l x ba, ca, a10 read / write illegal 2 l l h h ba, ra act illegal 2 l l h l ba, a10 pre / prea nop (idle after trp) 4 l l l h x refa illegal l l l l op-code, mode- add mrs illegal h x x x x desel nop (row active after trcd) l h h h x nop nop (row active after trcd) l h h l ba term illegal 2 l h l x ba, ca, a10 read / write illegal 2 l l h h ba, ra act illegal 2 l l h l ba, a10 pre / prea illegal 2 l l l h x refa illegal l l l l op-code, mode- add mrs illegal h x x x x desel nop l h h h x nop nop l h h l ba term illegal 2 l h l x ba, ca, a10 read / write illegal 2 l l h h ba, ra act illegal 2 l l h l ba, a10 pre / prea illegal 2 l l l h x refa illegal l l l l op-code, mode- add mrs illegal row activating write re- covering pre- charging
10 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram function truth table (continued) abbreviations: h=high level, l=low level, x=don't care ba=bank address, ra=row address, ca=column address, nop=no opera tion notes: 1. all entries assume that cke was high during the preceding clo ck cycle and the current clock cycle. 2. illegal to bank in specified state; function may be legal in the bank indicated by ba, depending on the state of that bank. 3. must satisfy bus contention, bus turn around, write recovery requirements. 4. nop to bank precharging or in idle state. may precharge bank indicated by ba. 5. illegal if any bank is not idle. 6. refer to read with auto - precharge in page 24. 7. refer to write with auto - precharge in page 26. illegal = device operation and/or data - integrity are not guaranteed. current state /cs /ras /cas /we address command action notes refreshing h x x x x desel nop (idle after trc) l h h h x nop nop (idle after trc) l h h l ba term illegal l h l x ba, ca, a10 read / write illegal l l h h ba, ra act illegal l l h l ba, a10 pre / prea illegal l l l h x refa illegal l l l l op-code, mode- add mrs illegal h x x x x desel nop (row active after trsc) l h h h x nop nop (row active after trsc) l h h l ba term illegal l h l x ba, ca, a10 read / write illegal l l h h ba, ra act illegal l l h l ba, a10 pre / prea illegal l l l h x refa illegal l l l l op-code, mode- add mrs illegal mode register setting
11 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram function truth table for cke abbreviations: h=high level, l=low level, x=don't care notes: 1. cke low to high transition will re - enable clk and other inputs asynchronously. a minimum setup time must be satisfied before any command ot her than exit. 2. power - down and self - refresh can be entered only from the all banks idle state. 3. must be legal command. current state cke n-1 cke n /cs /ras /cas /we address action notes h x x x x x x invalid 1 l h h x x x x exit self-refresh (idle after trc) 1 l h l h h h x exit self-refresh (idle after trc) 1 l h l h h l x illegal 1 l h l h l x x illegal 1 l h l l x x x illegal 1 l l x x x x x nop (maintain self-refresh) 1 h x x x x x x invalid l h x x x x x exit power down to idle l l x x x x x nop (maintain self-refresh) h h x x x x x refer to function truth table 2 h l l l l h x enter self-refresh 2 h l h x x x x enter power down 2 h l l h h h x enter power down 2 h l l h h l x illegal 2 h l l h l x x illegal 2 h l l l x x x illegal 2 l x x x x x x refer to current state =power down 2 h h x x x x x refer to function truth table h l x x x x x begin clk suspend at next cycle 3 l h x x x x x exit clk suspend at next cycle 3 l l x x x x x maintain clk suspend any state other than listed above self- refreshing power down all banks idle
12 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram simplified state diagram row active idle pre charge power down read reada write writea power on act refa refs refsx ckel ckeh mrs ckel ckeh write read writea writea reada read pre reada reada pre pre prea power applied mode register set self refresh auto refresh active power down automatic sequence command sequence write read pre charge all mrs burst stop term
13 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram power on sequence before starting normal operation, the following power on sequ ence is necessary to prevent a sdram from damaged or multifunctioning. 1. apply vdd before or the same time as vddq 2. apply vddq before or at the same time as vtt & vref 3. maintain stable condition for 200us after stable power and cl k, apply nop or dsel 4. issue precharge command for all banks of the device 5. issue emrs 6. issue mrs for the mode register and to reset the dll 7. issue 2 or more auto refresh commands 8. maintain stable condition for 200 cycle after these sequence, the ddr sdram is idle state and ready for normal operation. mode register burst length, burst type and /cas latency can be programmed by setting the mode register (mrs). the mode register stores these data until the next mrs command, which may be issued when both banks are in idle state. after tmrd from a mrs command, the ddr sdram is ready for new command. / cs / ras / cas / we a11 - a0 / clk clk ba0 ba1 r: reserved for future use 0 no 1 yes dll reset 0 sequential 1 interleaved burst type bt=0 bt=1 0 0 0 r r 0 0 1 2 2 0 1 0 4 4 0 1 1 8 8 1 0 0 r r 1 0 1 r r 1 1 0 r r 1 1 1 r r bl burst length /cas latency 0 0 0 r 0 0 1 r 0 1 0 2 0 1 1 r 1 0 0 r 1 0 1 r 1 1 0 2.5 1 1 1 r cl latency mode ba1 ba0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 0 0 0 0 0 0 dr 0 bt ltmode bl v
14 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram extended mode register dll disable / enable mode can be programmed by setting the e xtended mode register (emrs). the extended mode register stores these d ata until the next emrs command, which may be issued when all banks are in idle state. after tmrd from a emrs command, the ddr sdram is ready for new command. / cs / ras / cas / we a11 - a0 ba0 ba1 / clk clk ba1 ba0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 0 1 0 0 0 0 0 0 0 0 0 0 0 ds dd 0 normal 1 weak drive strength 0 dll enable 1 dll disable dll disable v
15 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram / cas latency burst length cl= 2 bl= 4 burst length a2 a1 a0 initial address bl sequential interleaved column addressing 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 - 0 0 - 0 1 - 1 0 - 1 1 - - 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1 7 0 1 2 0 1 2 3 1 2 3 0 2 3 0 1 3 0 0 1 7 6 5 4 0 1 2 3 1 0 3 2 2 3 0 1 3 2 0 1 - - 1 1 2 1 0 3 4 5 6 3 2 1 0 1 0 1 0 8 4 2 command address dq y y read write dqs q0 q1 q2 q3 d0 d1 d2 d3 / clk clk
16 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram absolute maximum ratings dc operating conditions ( ta=0 ~ 70 o c, unless otherwise noted) capacitance ( ta=0 ~ 70 o c, vdd = vddq = 2.5v + 0.2v, vss = vssq = 0v, unless otherwise noted) min. max. ci(a) input capacitance, address pin vi=1.25v 2.0 3.0 pf 11 ci(c) input capacitance, control pin f=100mhz 2.0 3.0 pf 11 ci(k) input capacitance, clk pin vi=25mvrms 2.0 3.0 0.25 pf 11 ci/o i/o capacitance, i/o, dqs, dm pin 4.0 5.0 0.50 pf 11 0.50 notes limits symbol parameter test condition unit delta cap.(max.) min. typ. max. vdd supply voltage 2.3 2.5 2.7 v vddq supply voltage for output 2.3 2.5 2.7 v vref input reference voltage 0.49*vddq 0.50*vddq 0.51*vddq v 5 vih(dc) high-level input voltage vref + 0.15 vddq+0.3 v vil(dc) low-level input voltage -0.3 vref - 0.15 v vin(dc) input voltage level, clk and /clk -0.3 vddq + 0.3 v vid(dc) input differential voltage, clk and /clk 0.36 vddq + 0.6 v 7 vtt i/o termination voltage vref - 0.04 vref + 0.04 v 6 notes limits symbol parameter unit symbol parameter conditions ratings unit vdd supply voltage with respect to vss -0.5 ~ 3.7 v vddq supply voltage for output with respect to vssq -0.5 ~ 3.7 v vi input voltage with respect to vss -0.5 ~ vdd+0.5 v vo output voltage with respect to vssq -0.5 ~ vddq+0.5 v io output current 50 ma pd power dissipation ta = 25 o c 1000 mw topr operating temperature 0 ~ 70 o c tstg storage temperature -65 ~ 150 o c
17 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram -75a -75 -10 x4 105 105 100 x8 110 110 105 x16 120 120 115 x4 110 110 105 x8 115 115 110 x16 135 135 130 60 60 55 65 65 60 75 75 70 x4 150 150 140 x8 170 170 160 x16 210 210 200 x4 145 145 135 x8 165 165 155 x16 200 200 180 idd5 auto refresh current: t rc = t rfc (min) x4/x8/x16 185 185 175 idd6 self refresh current: cke < 0.2v x4/x8/x16 3 3 3 x4 250 250 230 20 x8 260 260 240 20 x16 290 290 280 20 x4/x8/x16 idd2p idd2f idle standby current: /cs > vih (min); all banks idle; cke > vih (min); t ck = t ck min; address and other control inputs changing once per clock cycle idd4r operating current: burst = 2; reads; continuous burst;one bank active; address and control inputs changing once per clock cycle;cl=2.5; t ck = t ck min; iout = 0 ma precharge power-down standby current: all banks idle; power- down mode; cke < vil (max); t ck = t ck min active standby current: /cs > vih (min); cke > vih (min); one bank; active-precharge; t rc = t ras max; t ck = t ck min; dq,dm and dqs inputs changing twice per clock cycle; address and other control inputs changing once per clock cycle idd3n notes idd0 idd1 operating current: one bank; active-read-precharge; burst = 2; t rc = t rc min; cl = 2.5; t ck = t ck min; iout= 0ma; address and control inputs changing once per clock cycle symbol organization parameter/test conditions operating current: one bank; active-precharge; t rc = t rc min; t ck = t ck min; dq, dm and dqs inputs changing twice per clock cycle; address and control inputs changing once per clock cycle 20 20 limits(max.) ma 20 30 unit 40 40 30 30 40 idd7 operating current-four bank operation: four bank interleaving with bl=4 -refer to the notes 20 x4/x8/x16 idd4w operating current: burst = 2; writes; continuous burst; one bank active; address and control inputs changing once per clock cycle; cl=2.5; t ck = t ck min;dq, dm and dqs inputs changing twice per clock cycle x4/x8/x16 x4/x8/x16 idd3p active power-down standby current: one bank active; power- down mode; cke < vil (max); t ck = t ck min average supply current from vdd ( ta=0 ~ 70 o c, vdd = vddq = 2.5v + 0.2v, vss = vssq = 0v, output open, unless otherwise noted) ac operating conditions and characteristics ( ta=0 ~ 70 o c, vdd = vddq = 2.5v + 0.2v, vss = vssq = 0v, output open, unless otherwise noted) min. max. vih(ac) high-level input voltage (ac) vref + 0.31 vil(ac) low-level input voltage (ac) vref - 0.31 vid(ac) input differential voltage, clk and /clk 0.7 vddq + 0.6 7 vix(ac) input crossing point voltage, clk and /clk 0.5*vddq - 0.2 0.5*vddq + 0.2 8 ioz off-state output current /q floating vo=0~vddq -5 5 m a ii input current / vin=0 ~ vddq -2 2 m a ioh output high current (vout = vtt+0.84v) -16.8 iol output high current (vout = vtt-0.84v) 16.8 ma ma notes limits v v v symbol parameter / test conditions unit v
18 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram ac timing requirements ( ta=0 ~ 70 o c, vdd = vddq = 2.5v + 0.2v, vss = vssq = 0v, unless otherwise noted) min. max min. max min. max tac dq output valid data delay time from clk//clk -0.75 0.75 -0.75 0.75 -0.8 0.8 ns tdqsck dq output valid data delay time from clk//clk -0.75 0.75 -0.75 0.75 -0.8 0.8 ns tch clk high level width 0.45 0.55 0.45 0.55 0.45 0.55 tck tcl clk low level width 0.45 0.55 0.45 0.55 0.45 0.55 tck cl=2.5 7.5 15 7.5 15 8 15 ns cl=2 7.5 15 10 15 10 15 ns tds input setup time (dq,dm) 0.5 0.5 0.6 ns tdh input hold time(dq,dm) 0.5 0.5 0.6 ns tdipw dq and dm input pulse width (for each input) 1.75 1.75 2 ns thz data-out-high impedance time from clk//clk -0.75 0.75 -0.75 0.75 -0.8 0.8 ns 14 tlz data-out-low impedance time from clk//clk -0.75 0.75 -0.75 0.75 -0.8 0.8 ns 14 tdqsq dq valid data delay time from dqs 0.5 0.5 0.6 ns thp clock half period tclmin or tchmin tclmin or tchmin tclmin or tchmin ns tqh output dqs valid window thp-0.75 thp-0.75 thp-1.0 ns tdqss write command to first dqs latching transition 0.75 1.25 0.75 1.25 0.75 1.25 tck tdqsh dqs input high level width 0.35 0.35 0.35 tck tdqsl dqs input low level width 0.35 0.35 0.35 tck tdss dqs falling edge to clk setup time 0.2 0.2 0.2 tck tdsh dqs falling edge hold time from clk 0.2 0.2 0.2 tck tmrd mode register set command cycle time 15 15 15 ns twpres write preamble setup time 0 0 0 ns 16 twpst write postamble 0.4 0.6 0.4 0.6 0.4 0.6 tck 15 twpre write preamble 0.25 0.25 0.25 tck tis input setup time (address and control) 0.9 0.9 1.1 ns 19 tih input hold time (address and control) 0.9 0.9 1.1 ns 19 trpst read postamble 0.4 0.6 0.4 0.6 0.4 0.6 tck trpre read preamble 0.9 1.1 0.9 1.1 0.9 1.1 tck -10 unit notes tck clk cycle time symbol ac characteristics parameter -75a -75
19 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram ac timing requirements(continues) ( ta=0 ~ 70 o c, vdd = vddq = 2.5v + 0.2v, vss = vssq = 0v, unless otherwise noted) min. max min. max min. max tras row active time 45 120,000 45 120,000 50 120,000 ns trc row cycle time(operation) 65 65 70 ns trfc auto ref. to active/auto ref. command period 75 75 80 ns trcd row to column delay 20 20 20 ns trp row precharge time 20 20 20 ns trrd act to act delay time 15 15 15 ns twr write recovery time 15 15 15 ns tdal auto precharge write recovery + precharge time 35 35 35 ns twtr internal write to read command delay 1 1 1 tck txsnr exit self ref. to non-read command 75 75 80 ns txsrd exit self ref. to -read command 200 200 200 tck txpnr exit power down to command 1 1 1 tck txprd exit power down to -read command 1 1 1 tck 18 trefi average periodic refresh interval 7.8 7.8 7.8 m s 17 -10 unit notes symbol ac characteristics parameter -75a -75 output load condition dq output timing measurement reference point v ref v ref dqs v out v ref 30 pf 50 w v tt = v ref zo=50 w
20 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram notes 1. all voltages referenced to vss. 2. tests for ac timing, idd, and electrical, ac and dc character istics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operat ion are guaranteed for the full voltage range specified. 3. ac timing and idd tests may use a vil to vih swing of up to 1 .5v in the test environment, but input timing is still referenced to vref (or to the crossing point for ck//ck), and pa rameter specifications are guaranteed for the specified ac input levels under normal use conditions. the minim um slew rate for the input signals is 1v/ns in the range between vil(ac) and vih(ac). 4. the ac and dc input level specifications are as defined in th e sstl_2 standard (i.e. the receiver will effectively switch as a result of the signal crossing the ac input level, an d will remain in that state as long as the signal does not ring back above (below) the dc input low (high) level. 5. vref is expected to be equal to 0.5*vddq of the transmitting device, and to track variations in the dc level of the same. peak - to - peak noise on vref may not exceed + 2% of the dc value. 6. vtt is not applied directly to the device. vtt is a system su pply for signal termination resistors, is expected to be set equal to vref, and must track variations in the dc level of vref. 7. vid is the magnitude of the difference between the input leve l on clk and the input level on /clk. 8. the value of vix is expected to equal 0.5*vddq of the transmi tting device and must track variations in the dc level of the same. 9. enables on - chip refresh and address counters. 10. idd specifications are tested after the device is properly i nitialized. 11. this parameter is sampled. vddq = 2.5v + 0.2v, vdd = 2.5v + 0.2v , f = 100 mhz, ta = 25 o c, vout(dc) = vddq/2, vout(peak to peak) = 25mv. dm inputs are grouped with i/ o pins - reflecting the fact that they are matched in loading (to facilitate trace matching at the board le vel). 12. the clk//clk input reference level (for timing referenced to clk//clk) is the point at which clk and /clk cross; the input reference level for signals other than clk//clk , is vref. 13. inputs are not recognized as valid until vref stabilizes. ex ception: during the period before vref stabilizes, cke < 0.3vddq is recognized as low. 14. t hz and tlz transitions occur in the same access time windo ws as valid data transitions. these parameters are not referenced to a specific voltage level, but specify when the dev ice output is no longer driving (hz), or begins driving (lz). 15. the maximum limit for this parameter is not a device limit. the device will operate with a greater value for this parameter, but system performance (bus turnaround) will degrade accordingly. 16. the specific requirement is that dqs be valid (high, low, or at some point on a valid transition) on or before this clk edge. a valid transition is defined as monotonic, and m eeting the input slew rate specifications of the device. when no writes were previously in progress on the bus, dqs will be transitioning from high - z to logic low. if a previous write was in progress, dqs could be high, low, or trans itioning from high to low at this time, depending on tdqss. 17. a maximum of eight auto refresh commands can be posted to an y given ddr sdram device. 18. txprd should be 200 tclk in the condition of the unstable cl k operation during the power down mode. 19. for command/address and ck & /ck slew rate > 1.0v/ns. 20. idd7 : operating current:four bank for bank are being interleaved with trc(min),burst mode,ad dress and control inputs on nop edge are not changing.iout = 0ma timing patterns: tck=min,trrd=2*tck,bl=4,trcd=3*tck,read with autoprecharge read:a0 n a1 r0 a2 r1 n r3 a0 n a1 r0 ? repeat the same timing with random address changing *100% of data changing at every burst legend: a=activate,r=read,p=precharge,n=nop
21 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram / clk dqs tis tih vref clk valid data read operation tac tdqsck tcl tch tck tdqsq tqh trpre trpst dqs / clk clk tdqss tds tdh tdqsl tdqsh twpre write operation / tdqss=max. tdss twpres twpst dqs / clk clk tdqss tds tdh tdqsl tdqsh twpre write operation / tdqss=min. tdsh twpres twpst dq dq dq cmd & add.
22 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram the ddr sdram has four independent banks. each bank is activate d by the act command with the bank addresses (ba0,1). a row is indicated by the row addres s a12 - 0. the minimum activation interval between one bank and the other bank is trrd. bank activate operational description the pre command deactivates the bank indicated by ba0,1. when mu ltiple banks are active, the precharge all command (prea,pre+a10=h) is available to deactivat e them at the same time. after trp from the precharge, an act command to the same bank can be i ssued. precharge bank activation and precharge all (bl=8, cl=2) a precharge command can be issued at bl/2 from a read command wi thout data loss. precharge all command a0 - 9,11 a10 ba0,1 dq act xa xa 00 read y 0 00 act xb xb 01 pre trrd trcd 1 act xb xb 01 tras trp trcmin 2 act command / trcmin dqs qa0 bl/2 qa1 qa2 qa3 qa4 qa5 qa6 qa7 / clk clk
23 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram after trcd from the bank activation, a read command can be issue d. 1st output data is available after the /cas latency from the read, followed by (bl - 1) consecutive data when the burst length is bl. the start address is specified by a11,a9 - a0(x4)/a9 - a0(x8)/a8 - a0(x16), and the address sequence of burst data is defined by the burst type. a read comm and may be applied to any active bank, so the row precharge time (trp) can be hidden behin d continuous output data by interleaving the multiple banks. when a10 is high at a read comm and, the auto - precharge (reada) is performed. any command(read,write,pre,act) to the sam e bank is inhibited till the internal precharge is complete. the internal precharge start s at bl/2 after reada. the next act command can be issued after (bl/2+trp) from the previous rea da. read multi bank interleaving read (bl=8, cl=2) / clk command a0 - 9,11 a10 ba0,1 dq act xa xa 00 read y 0 00 read y 0 10 act xb xb 10 pre 0 00 trcd / cas latency burst length dqs qa0 clk qa1 qa2 qa3 qa4 qa5 qa6 qa7 qb0 qb1 qb2 qb3 qb4 qb5 qb7 qb8
24 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram read with auto - precharge (bl=8, cl=2,2.5) a0 - 9,11 a10 ba0,1 dq xa xa 00 y 1 00 dqs internal precharge start timing qa0 qa1 qa2 qa3 qa4 qa5 qa6 qa7 dq dqs qa0 qa1 qa2 qa3 qa4 qa5 qa6 qa7 cl=2 cl=2.5 trcd trp bl/2 bl/2 + trp command act reada / clk clk 0 1 2 3 4 5 6 7 8 9 10 11 12 operating description when new command asserted. legal legal illegal illegal illegal illegal illegal illegal writea(cl=2.5) legal legal legal illegal illegal illegal illegal illegal write(cl=2) legal legal legal legal legal legal legal legal pcg legal legal legal legal legal legal legal legal act legal legal legal illegal illegal illegal illegal illegal writea(cl=2) legal legal illegal illegal illegal illegal illegal illegal write(cl=2.5) legal legal legal legal legal legal legal legal reada legal 10 legal 9 legal 8 legal 7 legal 6 legal 5 legal 4 3 legal read for different bank asserted command
25 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram after trcd from the bank activation, a write command can be issu ed. 1st input data is set from the write command with data strobe input, following (bl - 1) data are written into ram, when the burst length is bl. the start address is specified by a11,a9 - a0(x4)/a9 - a0(x8)/a8 - a0(x16), and the address sequence of burst data is defined by the burst t ype. a write command may be applied to any active bank, so the row precharge time (trp) can be hidden behind continuous input data by interleaving the multiple banks. from the last data to t he pre command, the write recovery time (twrp) is required. when a10 is high at a write command, th e auto - precharge(writea) is performed. any command(read,write,pre,act) to the same bank is i nhibited till the internal precharge is complete. the next act command can be issued after tdal from the last input data cycle. write multi bank interleaving write (bl=8) command a0 - 9,11 a10 ba0,1 dq act xa 00 write 00 write 0 0 10 act xb 10 0 10 trcd d trcd d pre xa 0 00 pre dqs / clk clk da0 da1 da2 da3 da4 da5 da6 da7 db0 db1 db2 db3 db4 db5 db6 db7 xa ya yb xb
26 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram write with auto - precharge (bl=8) command a0 - 9,11 a10 ba0,1 dq act xa 00 writea 1 00 act xb 00 trc d da0 dqs / clk clk da1 da2 da3 da4 da5 da6 da7 tdal xa y xb legal legal legal legal legal legal legal legal pcg legal legal legal legal legal legal legal legal act legal legal legal legal legal legal legal legal writea legal legal legal legal legal legal legal legal write legal legal legal illegal illegal illegal illegal illegal reada legal 10 legal 9 legal 8 illegal 7 illegal 6 illegal 5 illegal 4 3 illegal read for different bank asserted command 0 1 2 3 4 5 6 7 8 9 10 11 12 operating description when new command asserted.
27 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram burst interruption [ read interrupted by read] burst read operation can be interrupted by new read of any bank. random column access is allowed. read to read interval is minimum 1clk. read interrupted by read (bl=8, cl=2) command a0 - 9,11 a10 ba0,1 dq yi read read read read yj yk yl 0 0 0 0 00 10 00 01 dqs qai0 qai1 qaj0 qaj1 qaj2 qaj3 qak0 qak1 qak2 qak3 qak4 qak5 qal0 qal1 qal2 qal3 qal4 qal5 qal6 qal7 / clk clk [ read interrupted by precharge] burst read operation can be interrupted by precharge of the same bank. read to pre interval is minimum 1 clk. a pre command to output disable latency is equiva lent to the /cas latency. as a result, read to pre interval determines valid data length t o be output. the figure below shows examples of bl=8. read interrupted by precharge (bl=8) cl=2.5 command dqs command dq command dq q0 q1 q2 q3 q0 q1 / clk clk dq q0 q1 q2 q3 q4 q5 pre read read pre read pre dqs dqs
28 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram read interrupted by precharge (bl=8) cl=2.0 / clk clk command dqs command dq command dq q0 q1 q2 q3 q0 q1 dq q0 q1 q2 q3 q4 q5 pre read read pre read pre dqs dqs
29 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram burst read operation can be interrupted by a burst stop command( term). read to term interval is minimum 1 clk. a term command to output disable latency is eq uivalent to the /cas latency. as a result, read to term interval determines valid data length to be output. the figure below shows examples of bl=8. [ read interrupted by burst stop] read interrupted by term (bl=8) cl=2.5 command dqs command dq command dq q0 q1 q2 q3 q0 q1 / clk clk dq q0 q1 q2 q3 q4 q5 term read read term read term dqs dqs cl=2.0 command dqs command dq command dq q0 q1 q2 q3 q0 q1 dq q0 q1 q2 q3 q4 q5 term read read term read term dqs dqs
30 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram [ read interrupted by write with term] read interrupted by term (bl=8) cl=2.5 command dq q0 q1 q2 q3 / clk clk read term dqs write d 0 d1 d2 d3 d4 d5 cl=2.0 command dq q0 q1 q2 q3 read term dqs write d0 d1 d2 d3 d4 d5 d6 d7
31 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram burst write operation can be interrupted by write of any bank. r andom column access is allowed. write to write interval is minimum 1 clk. [ write interrupted by write] [ write interrupted by read] burst write operation can be interrupted by read of the same or the other bank. random column access is allowed. internal write to read command interval(twtr) is minimum 1 clk. the input data on dq at the interrupting read cycle is "don't care". twtr is referenced from the first positive edge after the last data input. write interrupted by read (bl=8, cl=2.5) command a0 - 9,11 a10 ba0,1 dq write yi 0 00 read yj 0 00 dai0 dai1 qaj0 qaj1 qaj2 qaj3 qs qaj4 qaj5 qaj6 qaj7 dm twtr / clk clk write interrupted by write (bl=8) command a0 - 9,11 a10 ba0,1 write yi 0 00 write yk 0 10 write yj 0 00 write yl 0 00 dq dai1 daj1 daj3 dak1 dak3 dak5 dal1 dqs dal2 dal3 dal5 dal6 dal7 dal4 dal0 dak4 dak2 dak0 dai0 daj0 daj2 / clk clk
32 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram burst write operation can be interrupted by precharge of the sam e or all bank. random column access is allowed. twr is referenced from the first positive clk edge after the last data input. [ write interrupted by precharge] write interrupted by precharge (bl=8, cl=2.5) command a0 - 9,11 a10 ba0,1 dq write yi 0 00 pre 00 dai0 dai1 qs dm twr / clk clk
33 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram [ initialize and mode register sets] command / clk clk emrs pre nop mrs pre ar ar mrs act code code xa code xa 1 0 xa a0 - 9,11 a10 code 1 ba0,1 dqs dq 1 0 0 0 0 code tmrd tmrd trp trfc trfc tmrd mode register set, reset dll extended mode register set [ auto refresh] single cycle of auto - refresh is initiated with a refa(/cs=/ras=/cas=l,/we=cke=h) command. the refresh address is generated internally. 8192 refa cycles within 64ms refresh 256mbits memory cells. the auto - refresh is performed on 4 banks concurrently. before performing an auto refresh, all banks must be in the idle state. auto - refresh to auto - refresh interval is minimum trfc . any command must not be supplied to the device before trf c from the refa command. auto - refresh / ras cke / cs / cas / we a0 - 11 ba0,1 nop or deselect trfc auto refresh on all banks auto refresh on all banks / clk clk cke initialize and mrs
34 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram [ self refresh] self - refresh mode is entered by issuing a refs command (/cs=/ras=/cas =l,/we=h,cke=l). once the self - refresh is initiated, it is maintained as long as cke is kept lo w. during the self - refresh mode, cke is asynchronous and the only enable input, all other inputs including clk are disabled and ignored, so that power consumption due to synchrono us inputs is saved. to exit the self - refresh, supplying stable clk inputs, asserting desel or nop com mand and then asserting cke for longer than txsnr/txsrd. self - refresh / ras cke / cs / cas / we a0 - 11 ba0,1 txsnr self refresh exit / clk clk x y x y txsrd
35 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram the purpose of clk suspend is power down. cke is synchronous inp ut except during the self - refresh mode. a command at cycle is ignored. from cke=h to norma l function, dll recovery time is not required in the condition of the stable clk operation dur ing the power down mode. [ power down] / clk clk power down by cke command pre cke command act cke standby power down nop nop valid nop nop valid active power down dm is defined as the data mask for writes. during writes,dm mas ks input data word by word. dm to write mask latency is 0. [ dm control] dm function(bl=8,cl=2) command dqs dq dm write read d0 d1 d3 d4 d5 d6 d7 masked by dm=h don't care q2 q3 q4 q5 / clk clk q0 q1 q6 txpnr/txprd
36 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram keep safety first in your circuit designs! mitsubishi electric corporation puts the maximum effort into ma king semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due considerat ion to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxi liary circuits, (ii) use of non - flammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials these materials are intended as a reference to assist our custo mers in the selection of the mitsubishi semiconductor product best suited to the customer ? s application; they do not convey any license under any intellec tual property rights, or any other rights, belonging to mitsubishi electric corporation o r a third party. mitsubishi electric corporation assumes no responsibility for a ny damage, or infringement of any third - party ? s rights, originating in the use of any product data, diagrams, charts, pr ograms, algorithms, or circuit application examples contained in these materials. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by mitsubishi electric corporation without notice due to product improvements or other reasons. it is therefore recommended that customers contact mitsubishi electric corporation or an authoriz ed mitsubishi semiconductor product distributor for the latest product information before purchasing a product listed he rein. the information described here may contain technical inaccuracie s or typographical errors. mitsubishi electric corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to information published by mitsubishi electric corporation by various means, including the mitsubishi semiconductor home page ( http://www.mitsubishichips.com) . when using any or all of the information contained in these mat erials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. mitsubishi electr ic corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. mitsubishi electric corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at s take. please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor when con sidering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportati on, vehicular, medical, aerospace, nuclear, or undersea repeater use. the prior written approval of mitsubishi electric corporation i s necessary to reprint or reproduce in whole or in part these materials. if these products or technologies are subject to the japanese e xport control restrictions, they must be exported under a license from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws an d regulations of japan and/or the country of destination is prohibited. please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor for further details on these materials or the products contained therein.
37 mitsubishi electric jul. '01 preliminary mitsubishi lsis ddr sdram (rev.1.0) m2s56d20/ 30/ 40akt 256 m double data rate synchronous dram revision history jul. ? 01 date - new registration (jul. ? 01) 1.0 description rev.


▲Up To Search▲   

 
Price & Availability of M2S56D20ATP

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X